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New Streamlined EM Setup allows the same setup for Momentum, Momentum RF, & FEM making it easy to try different solvers on the same design.

Updated Momentum solver offers over 4x simulation speed improvement.

Uncover 3-D electromagnetic interactions of bondwires, solder balls, packages, including traces and spiral inductors on the integrated circuits and laminates.

Simulate multiple integrated circuits (laminate and package) with Keysight’s industry-leading simulation technology.

Learn more about Design and Simulation of High Speed Digital. IBIS-AMI model simulation support for fast, accurate SerDes models for ‘what if…?’ channel simulation. ADS 2011 offers accurate modeling of multi-GHz effects with an easy setup via our SI/PI analysis tool.

Unique capability added for Power Integrity analysis on PCBs and packages with heavily perforated power ground planes. Using ADS 2011, engineers can design individual RF and microwave integrated circuits with different technologies (e.g., GaAs, SiGe, GaN, and Silicon CMOS). Tradeoffs can be made interactively on the IC, laminate, packaging and print circuit boards being designed or co-designed together. Multi-technology design allows multiple IC’s combined with laminate and packaging PCB to all be designed together. Take a look at some of the new ADS 2011 videos on Youtube.

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With ADS 2011, design verification no longer needs to stop at the boundary of a single integrated circuit’s or module’s technology. It also offers engineers the ability to design multiple RF and microwave integrated circuits (implemented with a variety of technologies), assemble them in a package or on a multilayer laminate, and simulate electrical and 3-D electromagnetic performance – all within a single platform.

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Improvements for High Speed Digital - Redriver/Retimer Models for the HSD Channel Simulator Faster Via modeling in Momentum Support for IBIS Series modelsĪDS 2011 features capabilities that help uncover and resolve integration issues early in the design process, before fabrication of wireless components like power amplifiers and RF front-end modules.

PCB Import Improvements - Improved ODB++ Import New Net Explorer simplifies the finding and isolating key nets for EM simulation.

Completely Redesigned Help System - Much faster, easier document browsing, expanded content, new application guides.

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Design Documentation Notebook - Easier to create and share project documentation including schematics, layout, data displays Supports PDF and post script format.

Circuit Simulation Improvements - 4X improvement to Linear Simulation performance for tuning and sweeps New updated models Improved Load Pull DesignGuide.

EM Simulation Improvements - Single substrate definition for both FEM and Momentum Simplified multi-technology definition 2X speed improvement with new FEM multi-threaded iterative solver.

Customer Input - Over 160 customer requested improvements and enhancements.ĪDS 2011.10 builds upon the ADS 2011.05 release and includes:.

Solaris Support - Support for 64-bit versions of Solaris 10.

Users should evaluate ADS Gerber Import for suitability to replace Gerber Union.

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Note: As of ADS 2009 Update 1, Gerber Import was included with W2321 ADS Layout (and E8902).

Gerber Union Support - For customers who still require W2322 Gerber Union Element in their design flow.

GDSII Export - Simplified and automated layer mapping capability.

One-click HSPICE encryption - Simplifies generation of IP-protected IC models.

Printing and PDF output improvements - A number of improvements to printing for Schematic, Layout, and Data Display.

Simulation performance improvement for large X-parameter files - A new model reduction feature enables you to improve performance when simulating with X-parameters.

In addition to the ADS 2011.01 capabilities listed above, ADS 2011.05 adds:

Dozens of other improvements - including re-designed icons for layout and command menus, linear simulation speedup, broader data display capability, and improved transmission line modelsĪDS 2011.05 builds upon the ADS 2011.01 release.

New Layout Improvements - layout capacity and performance to handle growing complexity.New Load Pull Data Controller - from load pull data to design and simulation in a couple of clicks.

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Integrated Electromagnetic Solvers - for faster, more accurate simulations and a new use model that makes it easier to setup and run 3D planar and full 3D electromagnetic simulations.

High Speed Digital - IBIS-AMI SerDes model simulation and the industry's first Power Integrity solution for heavily perforated power ground planes.

Multi-Technology Co-Design - the industry's first and only true multi-technology design environment.

Advanced Design System (ADS) 2011.01, ADS 2011.05, and ADS 2011.10 provide the following new capabilities: